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Nakaj's avatar
Nakaj
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1 year ago
Solved

MAX V Exposed pad solder reflow problem

A reflow soldering failure occurred on the exposed pad on the bottom of the QFP64 pin device of the MAX V device. Please let me know if there is a recommended pattern layout for Exposed Pad. Plea...
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  • FakhrulA_altera's avatar
    FakhrulA_altera
    1 year ago

    Thanks for your response, I now transition this thread to community support. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you.


Nakaj's avatar
Nakaj
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1 year ago

Thank you for your reply.

I would like to know about recommended thickness of the solder mask(stencil?) of MAX V QFP64 device.

About reccomended pattern layout for PCB, I found a Cadence and mentor graphics CAD data in Intel website.

PCB design engineer tries to analyse it.

Regards

Nakaj