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EP3SE110F1152C2G's avatar
EP3SE110F1152C2G
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4 years ago
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FPGA MAX Reflow Temperature Issue

Hi Intel Team It's urgent. Pls help to confirm (MPN: EP3SE110F1152C2G) FPGA MAX Reflow Temperature Issue, material label shown us the max reflow temperature is 245 ℃，is it right? Can you sen...
  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    4 years ago

    Hi,


    The purpose of AN353 is for customer to compare, confirm and follow the guidance in the document. As seen in Table 4, it can be confirm that max reflow temp marked on the label is correct.


    Regards,

    Aiman


  • EP3SE110F1152C2G's avatar
    EP3SE110F1152C2G
    Icon for New Contributor rankNew Contributor
    4 years ago

    Hi Aiman,

    The AN353 is a recommended data according to IPC standard. Our purpose is to seek INTEL's help to confirm if the max reflow temp marked on the label is right or not. please refer to the attached label.

    It's quite urgent for flex production, please help to verify.

    Regards

    Brian