Hi Angela_xu,
For your information, Intel FPGA Reliability Report had stated clearly that we perform comprehensive testing and manufacturing controls on all its products. Altera Reliability Report Figure 1 shows a typical product manufacturing flow. Thus, the devices are leaving factory in good and working condition. Furthermore, Altera can provide automotive supply chain with the highest levels of quality and reliability because all of Altera’s manufacturing partners (TSMC, ASE and AMKOR) are certified and registered to ISO/TS 16949 automotive industry quality standard. Please refer Altera Reliability Report page 4, Altera Quality System:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/rr/rr.pdf
By referring to the Intel FPGA Failure Analysis Service - we test all devices for shorts and opens before the devices leave our factory. All our devices are fully tested as good before shipped to customer. The purpose of production testing during manufacturing is to screen out bad units and in the case of this case, short in circuit diagram
https://www.intel.com/content/www/us/en/programmable/support/support-resources/operation-and-testing/dvs-failure_analysis.html
The short issue is highly suspected caused by an EOS event. This may be caused during reflow or just by someone touching the device or board without discharging themselves. This issue is generally due to Electrical Overstress (EOS) issue and we don’t see any valid reason to bring the device in for failure analysis.
Thanks!
Regards,
Wani