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Oliver_I_Sedlacek's avatar
Oliver_I_Sedlacek
Icon for Contributor rankContributor
2 years ago
Solved

EP4CGX110CF23CN, which package

Is this FBGA a flip chip or wire bond as I need to know which package I will get.

The data sheet (attached) lists both.

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  • NazrulNaim_Intel's avatar
    NazrulNaim_Intel
    2 years ago

    Hello,


    I'm truly sorry for the delay. For your information this device is Wire Bond.


    Hope that answers your question.


    Best regards,

    Nazrul Naim


4 Replies

  • NazrulNaim_Intel's avatar
    NazrulNaim_Intel
    Icon for Regular Contributor rankRegular Contributor
    2 years ago

    Hello,


    To answer your question, you will get the FBGA-484 package.


    Hope that answers your question.


    Best regards,

    Nazrul Naim


    • Oliver_I_Sedlacek's avatar
      Oliver_I_Sedlacek
      Icon for Contributor rankContributor
      2 years ago

      No, that doesn't answer the questions as both options listed are FBGA-484.

  • NazrulNaim_Intel's avatar
    NazrulNaim_Intel
    Icon for Regular Contributor rankRegular Contributor
    2 years ago

    Hello,


    I'm truly sorry for the delay. For your information this device is Wire Bond.


    Hope that answers your question.


    Best regards,

    Nazrul Naim


  • NazrulNaim_Intel's avatar
    NazrulNaim_Intel
    Icon for Regular Contributor rankRegular Contributor
    2 years ago

    Hello,

    I’m glad that your question has been addressed, I now transition this thread to community support. If you have a new question, Please login to ‘https://supporttickets.intel.com’, view details of the desire request, and post a feed/response within the next 15 days to allow me to continue to support you. After 15 days, this thread will be transitioned to community support. The community users will be able to help you on your follow-up questions.

    Best regards,

    Nazrul Naim