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Oliver_I_Sedlacek's avatar
Oliver_I_Sedlacek
Icon for Contributor rankContributor
2 years ago
Solved

EP4CGX110CF23CN, which package

Is this FBGA a flip chip or wire bond as I need to know which package I will get. The data sheet (attached) lists both.
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  • NazrulNaim_Intel's avatar
    NazrulNaim_Intel
    2 years ago

    Hello,


    I'm truly sorry for the delay. For your information this device is Wire Bond.


    Hope that answers your question.


    Best regards,

    Nazrul Naim


NazrulNaim_Intel's avatar
NazrulNaim_Intel
Icon for Regular Contributor rankRegular Contributor
2 years ago

Hello,


To answer your question, you will get the FBGA-484 package.


Hope that answers your question.


Best regards,

Nazrul Naim


  • Oliver_I_Sedlacek's avatar
    Oliver_I_Sedlacek
    Icon for Contributor rankContributor
    2 years ago

    No, that doesn't answer the questions as both options listed are FBGA-484.