Forum Discussion
Mengzhe
Occasional Contributor
2 years agoHi,
Please refer to the following documents:
- PCN0904 Cyclone® III Family Process Shrink from 65-nm to 60-nm and Package Bill of Material Change (intel.com)
- PCN1205 ADDITIONAL ASSEMBLY SOURCE (ASE) AND TRANSITION TO CENTER PIN GATE MOLD FOR FBGA PACKAGES (intel.com)
Best Regards,
Mengzhe