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Altera_Forum
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16 years ago

EP3C40F780C8N devices damaged after reflow

Hi All, Has anyone had any production problems with the EP3C40 having low resistance shorts between IO pads and ground after reflow? We are getting a lot of boards failing this way. Thin...
Altera_Forum's avatar
Altera_Forum
Icon for Honored Contributor rankHonored Contributor
16 years ago

Did you x-ray the board? Or inspect the inner ball connects with an endoscope camera? I rather expect solder than device internal shorts.

P.S.: I didn't read the post completely. You verified internal shorts. That's rather unusual in my opinion. Did you keep the storage time after opening the dry device packing. Risk of package delamination due to adsorbed moisture is the most critical issue, I think.