Forum Discussion
Altera_Forum
Honored Contributor
11 years agoI don't know the answer but I'll move this to the non-SoC section of the forum since this section is for the SoC FPGAs which have ARM processors inside them.
Also can you clarify what the question is about? I can't tell if you are asking if there will be sufficient heat dissipation through the pads to the board or if your concern is power reliability related.