New ContributorHi,
My question is what are the package case type (metal/plastic) of the different pin count packages of the Cyclone 10 GX device (484-UBGA, 672-FBGA and 780-FBGA)?
Thanks in advance,
-Sulaiman
Hi Sulaiman,
I apologies for miss interpreting you inquires. To know the material type, you can refer to the device material declaration report.
Thank you
Regards,
Chia Ling
ContributorHi Sulaiman,
Thank you for contacting Intel Community. According to the AN71 document, we notice that the U484, F672, and F780 package devices come with a tray. For details, kindly refer to Table 6 of AN71:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/an/an071.pdf
Please do not hesitate to let me know if you need further assistance.
Thank you
Regards,
Chia Ling
New ContributorDear Chia Ling,
Thank you for your response.
I couldn't find any information about the package type in referred document. It seems it is about how are the different packages are stored and how to handle them. I'm looking to know what is a single chip lid type.
To clarify my question, for the single BGA chip, what is the material type of the lid (metal/plastic).
Regards,
-Sulaiman
ContributorHi Sulaiman,
I apologies for miss interpreting you inquires. To know the material type, you can refer to the device material declaration report.
Thank you
Regards,
Chia Ling
ContributorHi Sulaiman,
We do not receive any response from you to the previous reply that I have provided. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get support from Intel experts. Otherwise, the community users will continue to help you on this thread.
Thank you
Regards,
Chia Ling
