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AkHi's avatar
AkHi
Icon for New Contributor rankNew Contributor
4 years ago

Cyclone 10 GX - Static power

Hello Dear Community, We want to start new design using Cyclone 10GX (obviously it will be the fast available Inte FPGA). I start by setting up the EPE file to size the power supplies. I am surpris...
Ash_R_Intel's avatar
Ash_R_Intel
Icon for Regular Contributor rankRegular Contributor
4 years ago

Hi,

I found this information on the EPE user guide for Cyclone 10 GX, https://www.intel.com/content/www/us/en/programmable/documentation/jlc1485535013520.html#jya1492549887577

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Not Using a Heatsink

When you do not use a heat sink, the major paths of power dissipation are from the device to the air. You can refer to this as a junction-to-ambient thermal resistance. In this case, there are two significant junction-to-ambient thermal resistance paths:

  • From the device through the case to the air
  • From the device to the board

Figure 8. Thermal Representation without a Heat Sink

In the model used in the EPE spreadsheet, power is dissipated through the case and board. The θJA values are calculated for differing air flow options accounting for the paths through the case and through the board.

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It indicates that even though there is no heat sink, the tool considers a board thermal model typical value in calculation of θJA. So, it is not ignoring it.


For the with heat sink configurations, it allows user to add this value. "The path through the board has less impact than the path to air."


Regards