BGA TDN-741-954-61 (MPN# 5SGXMABK3H40C2LG ) short bridging issue for BGA

Hi Intel Team,

We found the solder bridging issue observed on BGA component (Part No: TDN-741-954-61_MPN#5SGXMABK3H40C2LG ) used in the Teradyne TDN-627-000-40 model.

Background:

We have been experiencing intermittent (on-and-off) solder bridging defects, predominantly located at the edge of the BGA during SMT assembly. Although the occurrence rate is relatively low (16/1200 boards), the repetition across builds has raised concern on potential component-related contribution.

To further understand the failure mechanism, a Shadow Moiré (TherMoire) analysis was conducted to evaluate the package coplanarity behavior across the full reflow temperature profile.

Summary of Key Findings:

1. De-soldered (failed) sample shows higher warpage, with coplanarity up to 9.8 mil
2. Incoming reference sample shows lower warpage, with max ~6.4 mil
3. Warpage remains ~5 mil even near peak reflow temperature (220–250°C)
4. Observed defect location (BGA edge bridging) is consistent with warpage-induced coplanarity.

These findings suggest that package warpage at elevated temperature could be a contributing factor to the observed solder bridging.

Please do advise and provide the details following questionnaire: -

1. Confirm warpage/coplanarity specification limits at reflow condition and whether our observed (~9.8 mil) is within acceptable range.
2. Provide details on BGA material properties, especially Tg and its impact on warpage behavior during reflow.
3. Explain the difference between good (incoming) vs failed sample in terms of warpage.
4. Share warpage control method and monitoring at supplier side (e.g., measurement method, control limits).
5. Provide lot traceability check to identify any variation or abnormality if have.
6. Advise on risk of solder bridging due to warpage and recommended mitigation as the stencil opening followed recommendation.
7. Flex Penang would like to send for FA. Please kindly provide RMA, forwarder account, shipping details, attention to and contact number.

Thanks,

Norizwan