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DAW290
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2 years ago

BGA Material for the 5CEFA5U19I7N FPGA

There is a three page document "Altera Device Package Information" (copy att.) that shows two options for solder ball composition for the 5CEFA5U19I7N part: "Regular" is 63% Sn/37% Pb and "Pb-free" i...
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DAW290's avatar
DAW290
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2 years ago

Thank you for the help with my case. I understand from your reply that the "N" suffix specifies Pb-free packaging. Would ordering the part without the "N" suffix - that is, ordering the part number 5CEFA5U19I7 - result in parts packaged with the 63Sn:37Pb solder ball composition? This was an option highlighted in a package information document (copy att.).