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DAW290's avatar
DAW290
Icon for New Contributor rankNew Contributor
2 years ago

BGA Material for the 5CEFA5U19I7N FPGA

There is a three page document "Altera Device Package Information" (copy att.) that shows two options for solder ball composition for the 5CEFA5U19I7N part: "Regular" is 63% Sn/37% Pb and "Pb-free" i...
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NazrulNaim_Intel's avatar
NazrulNaim_Intel
Icon for Regular Contributor rankRegular Contributor
2 years ago

Hello,

​

Sorry for the dela, for your information, the one that specify the solder ball option when ordering is the suffix. For an example 5CEFA5U19I7N. The N suffix is PB-Free packaging.

Hope that answers your question.

Best regards,

Nazrul Naim