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mattdomenick's avatar
mattdomenick
Icon for New Contributor rankNew Contributor
1 year ago

Agilex 9 Thermal Specifications

Performing a thermal analysis that includes AGRW027R28A2I2V. I have a STEP file of the thermal model as well as the material properties, but am interested in how power is distributed among the die, and the maximum junction temperature of each die.

Programmable Logic Device

3 Replies

  • FakhrulA_altera's avatar
    FakhrulA_altera
    Icon for Regular Contributor rankRegular Contributor
    1 year ago

    Hi,


    This document requires internal access and isn’t straightforward to retrieve. We are currently checking with the internal team and will provide you with the information as soon as we have it.


    Thank you for your patience.


    Best regards,

    Fakhrul


  • FakhrulA_altera's avatar
    FakhrulA_altera
    Icon for Regular Contributor rankRegular Contributor
    1 year ago

    Hi Mattdomenick,


    Apologies for the delay due to the end-year and New Year holidays. Essentially, the core of Agilex 9 and Agilex 7 are the same. Therefore, the junction temperature should follow the same specifications as outlined in the Agilex 7 datasheet under Recommended Operating Conditions. For power distribution, you can refer to the Agilex™ 7 Power Distribution Network Design Guidelines and use the PDN tool as a reference.


    Regards,

    Fakhrul


  • FakhrulA_altera's avatar
    FakhrulA_altera
    Icon for Regular Contributor rankRegular Contributor
    1 year ago

    I hope that your question has been addressed, I now transition this thread to community support. If you have a new question, feel free to open a new thread to get the support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you.