KLiew7
New Contributor
New Contributor10CL040YU484A7G
Hi,
Could you please help to review the below question and advise?
As per supplier :
Please advise the lead finishing for this PN#10CL040YU484A7G.
If gold, please advise thickness & gold plating process (ENIG: Electroless Nickel Immersion Gold
ENEPIG: Electroless Nickel Electroless Palladium Immersion Gold, NiPdAu: Nickel Palladium Gold)
Thanks.
Regards,
Kent
Hello,
The evaluated packages with matte tin (Sn) and/or Sn-2% copper (Cu) lead finish for leaded packages, and Sn-3-4% silver(Ag)-0.5% Cu solder balls for Pb-free BGA packages.
Please refer to this document: https://www.intel.cn/content/dam/www/programmable/us/en/pdfs/literature/wp/wp_chmfgrelldfr.pdf
Thank you.
