ADobr
New Contributor
New ContributorHow to proceed to send to analysis 1 pc ALC3-1AB310260004_REP / 5SGXMA7N2F45I3N?
Problem description: Test OAI fail Detected by: “R&D Nokia”
Forum Discussion
Zawani_M_Intel
Frequent Contributor
Frequent ContributorHi Alina,
Can you help to share some failure details for your issue ;
1. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units.
2. What is the failure symptom? Please elaborate the failure symptom in detail.
3. When did the failure happen? How did you discover the failure?
4. How did you determine the failure? Please elaborate the procedures.
5. Does the failure unit ever working before failure?
6. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.
7. Did you swap the failure device to a known good board? Is the failure following the device or board?
8. Is this a prototype build or volume/mass production?
9. Kindly provide quantitative investigation result that could proof the failure is Intel FPGA induced.
Please do not share confidential information publicly. If you required private message, please do let us know.
Thanks!
Wani
ADobrHi WaniMY, Please see below the answers. “ 1. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units. N/A 2. What is the failure symptom? Please elaborate the failure symptom in detail. Add2 temp = 87°C 21 sigevents ID7 (Obelix Config Failed/InitAsic Failed/FLTS cktPkFlt) NGOCC_IMAGE_ID : 40023900 NGOCC_BUILD_ID : b_171212 EEPROM dump done. Prescreening KO: Card Failure - device at 25°C : Card Failure - device at 25°C, by Tx DSP: OTN OOF, OTN LOF and many SFIS Errors active + Sig. Events "Obelix Config Failed" 3. When did the failure happen? How did you discover the failure? In field. We do not have this information. 4. How did you determine the failure? Please elaborate the procedures. For common FPGA defects on 100/200G SDFEC items (eg. ADD2, Obelix, FlexFramer) we are supported by a list of corrective actions (provided by Nokia), a list that contains a description of the failures and the corrective action needed (repair indication, RMA note to supplier), based on the encountered defect. The way we determine the failure is mainly based on our experience and the indications received by R&D, due to the large number of failed boards and the variety of failures that we analyzed during the life cycle of these products. If a FPGA needs to be sent to the supplier, it is usually followed by a RMA note/request, as found mentioned above. 5. Does the failure unit ever working before failure? YES 6. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles. Everything was in correct profiles/paramaters 7. Did you swap the failure device to a known good board? Is the failure following the device or board? YES. After the replacement with a new device, the failure disappeared. 8. Is this a prototype build or volume/mass production? Mass production 9. Kindly provide quantitative investigation result that could proof the failure is Intel FPGA induced. If the issue is not due to soldering, after the FPGA has been replaced, everything works well. We ask Intel to re-test the device to ensure that it meets the necessary parameters required by Nokia. Please provide RMA and shipping instructions. Thank you and Best Regards, [cid:image001.png@01D5C485.F2075940] Alina Dobri Supplier Quality Engineer Calea Torontalului DN6, km5.7 RO-300000 Timisoara Romania Phone number: 0040356474010 Creating value that increases customer competitiveness alina.dobri@flex.com<mailto:alina.dobri@flex.com> www.flextronics.com<http://www.flextronics.com/>
