What is the maximum downward pressure that can be applied to the top of Intel® FPGA BGA packages?
Description The following guidelines refer to the downward pressure or compressive load that can be applied to the top of Intel® FPGA BGA packages: For packages with eutectic SnPb (tin-lead) balls, use the following constant compressive loads: - 3g per solder ball for 0.5mm pitch MBGA package - 6g per solder ball for 0.8mm pitch UBGA package - 7g per solder ball for 0.92mm hex pitch FBGA package - 8g per solder ball for 1.00mm hex pitch FBGA package - 8g per solder ball for 1.00mm pitch FBGA package - 12g per solder ball for 1.27mm pitch BGA package For packages with SAC (tin-silver-copper) solder balls, use the following constant compressive loads: - 7g per solder ball for 0.5mm pitch MBGA package - 12g per solder ball for 0.8mm pitch UBGA package - 14g per solder ball for 0.92mm hex pitch FBGA package - 15g per solder ball for 1.00mm hex pitch FBGA package - 16g per solder ball for 1.00mm pitch FBGA package - 24g per solder ball for 1.27mm pitch BGA package For heat-sink application, Intel's recommendation is to not exceed 20g load per solder ball Your PCB and the supporting frame should be designed to withstand the pressure of the downward force to prevent bending or flexing of your PCB.