What is the maximum downward pressure that can be applied to the top of Altera BGA packages?
Description The following guidelines refer to the downward pressure or compressive load that can be applied to the top of Altera® FPGA BGA packages. Pitch (mm) Pattern Package Type Constant Compressive Load per Solder Ball (g) Eutectic SnPb (tin-lead) SAC (tin-silver-copper) 0.5 Grid MBGA 3 7 0.8 Grid UBGA 6 12 0.92 Hex FBGA 7 14 1 Hex FBGA 8 15 1 Grid FBGA 8 16 1.27 Grid BGA 12 24 Resolution For heat-sink application, Altera recommends heat sink pressure on the package between 20psi to 40psi for effective Thermal Interface Material (TIM) performance Your PCB and the supporting frame should be designed to withstand the pressure of the downward force to prevent bending or flexing of your PCB.