Knowledge Base Article
What is the maximum downward pressure that can be applied to the top of Altera BGA packages?
Description
The following guidelines refer to the downward pressure or compressive load that can be applied to the top of Altera® FPGA BGA packages.
|
Pitch (mm) |
Pattern |
Package Type |
Constant Compressive Load per Solder Ball (g) | |
|
|
|
|
Eutectic SnPb (tin-lead) |
SAC (tin-silver-copper) |
|
0.5 |
Grid |
MBGA |
3 |
7 |
|
0.8 |
Grid |
UBGA |
6 |
12 |
|
0.92 |
Hex |
FBGA |
7 |
14 |
|
1 |
Hex |
FBGA |
8 |
15 |
|
1 |
Grid |
FBGA |
8 |
16 |
|
1.27 |
Grid |
BGA |
12 |
24 |
Resolution
For heat-sink application, Altera recommends heat sink pressure on the package between 20psi to 40psi for effective Thermal Interface Material (TIM) performance
Your PCB and the supporting frame should be designed to withstand the pressure of the downward force to prevent bending or flexing of your PCB.
Updated 1 month ago
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