Part Information Request

I’m a Radiation Effects Engineer performing a component Single Events Effects (SEE) sensitivities assessment to the part: 10CL040YU484A7G.

I would like to know the following wafer fabrication information for the mentioned part:

1. Initial Release Date and Latest revision.

2. the minimum feature size (Distance between the elements that make up the structures on a chip, commonly known as wafer node, tech node or feature size). The size of the features are measured in nanometers. A 22 nm process technology refers to features 22 nm or 0.022 µm in size. Also called a "technology node" and "process node," early chips were measured in micrometers.

3. the process technology used (Semiconductor technology, example: bipolar, MOSFET, CMOS, etc.)

Thanks.