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Not quite.
For a given process corner (ie, holding the process factor constant) and fixed voltage the FPGA will run faster at 0'C than it does at 85'C. This is a characteristic of the CMOS process.
Again holding the process constant and at a constant die temperature, the FPGA will run faster at a higher voltage than at a lower voltage (within the operating voltage limits of the design).
And lastly, for any fixed temperature and fixed voltage, there will be some FPGA die that run faster and some slower. This is process variability.
So to robustly test a design over all operating parameters, one might use a fast process part running at low temperature and maximum voltage. And then use a slow process part running at high temperature and minimum operating voltage.
Unless you are a high volume corporate customer of Altera's you won't ever be able to get 'fast' and 'slow' process corner parts (other than selecting -6 or -8 speed grades yourself). But you can test at high and low temp, and at high and low operating voltage.
Commercial product developers (of which I was one) routinely do this multiple corner testing as part of the DVT (design validation test) process prior to volume manufacturing.
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I would say yes temperature inversion exists but is a new theme nowadays, look at this link:
http://ziyang.eecs.umich.edu/~****rp/talp/papers/dasdan-temperature.pdf http://robert****.org/talp/papers/dasdan-temperature.pdf or may be google: dasdan-temperature.pdf
as link is killed by this site due to bad name(di*k). Sorry Forum but that is the most important part of our anatomy and does show temperature inversion as well
Already I have a design in Arria10 that consistently shows recovery/removal failures at 0 but not at 100 for same other conditions. I will assume it is temperature inversion.
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