New ContributorHi,
Could you please help to review the below question and advise?
As per supplier :
Please advise the lead finishing for this PN#10CL040YU484A7G.
If gold, please advise thickness & gold plating process (ENIG: Electroless Nickel Immersion Gold
ENEPIG: Electroless Nickel Electroless Palladium Immersion Gold, NiPdAu: Nickel Palladium Gold)
Thanks.
Regards,
Kent
New ContributorHi,
Any update?
Please advise.
Thanks.
Regular ContributorHello,
Altera has evaluated packages with matte tin (Sn) and/or Sn-2% copper (Cu) lead finish for leaded packages, and Sn-3-4% silver(Ag)-0.5% Cu solder balls for Pb-free BGA packages.
Please refer to this document: https://www.intel.cn/content/dam/www/programmable/us/en/pdfs/literature/wp/wp_chmfgrelldfr.pdf
Thank you.
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