New Contributor
Regular ContributorHello,
Altera has evaluated packages with matte tin (Sn) and/or Sn-2% copper (Cu) lead finish for leaded packages, and Sn-3-4% silver(Ag)-0.5% Cu solder balls for Pb-free BGA packages.
Please refer to this document: https://www.intel.cn/content/dam/www/programmable/us/en/pdfs/literature/wp/wp_chmfgrelldfr.pdf
Thank you.
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