Forum Discussion
Altera_Forum
Honored Contributor
13 years agoLike you I searched a lot on the Altera website to find recommendations (...) for our DDR3 RAM Interface and did not find much. We are using an ArriaV that has no support for write leveling just as the CycloneV. The EMI Handbook has a few recommendations and at one point some numbers for max. skew etc.
The balanced tree topology (T shape) is not a bad topology at those frequencies. As DDR2 DIMMs have the same topology and also work up to (and somewhat above) 400MHz a layout for two components should not be that difficult or degrade performance. The critical signals are the command/ADR signals and of course the skew between them. If you stay in the specified ranges and use a proper termination scheme there shouldn't be any problems. If you are not sure about your signal integrity, you can perform simulations using tools like Hyperlinx. We did that with our ArriaV with two x16 components connected. Running the interface with 533 MHz shouldn't be a major problem so I think 400MHz should be possible for a CycloneV device. [We terminate the command lines directly at the star point and not behind every single component. Simulation results showed us that this is better for our setup. All signal lines are 50 ohms.] I would suggest to use x16 components instead of the x8 ones to reduce the load on the command and address lines. When selecting the memory chips, be aware that there are dual-die components available that have of course a higher load than single-die types, especially when you are looking for 4Gb chips! As far as I know Micron has new 4Gb x16 single die components listed as samples on their website. There is an ArriaV demoboard coming out quite soon. This includes a dual x32 DDR3 Interface. Look for arriaVGX_5agxfb3hf35es_start on the Altera FTP Server ( ftp://ftp.altera.com/outgoing/devkit/11.1/ ). On youtube I found a short but informing video, just search for DDR3 layout.