Forum Discussion
Benedict_Goh
New Contributor
New ContributorSTRATIX10 Maximum Pressure
Hi, I would like to apply a Thermal Interface Material (TIM) to contact the STRATIX10 chip and a heatsink and I have a few questions:
1. What is the maximum pressure that can be applied to the to...
Ash_R_Altera
Regular Contributor
Regular ContributorHi Benedict,
I got a chance to talk to the author of AN659 that I referenced earlier and enquired about the lidded package as well.
Turns out that the requirement remains the same for both lidded and lidless package.
You can also refer to following Knowledge article: https://www.intel.com/content/www/us/en/support/programmable/articles/000077198.html?wapkw=downward%20pressure
The information in the article is also present in AN659.
Regards
