ADHISH
New Contributor
New ContributorRequest of Physical Component Dimensions for 5CGXFC7D6F31I7N
We are currently in the process of creating the CAD footprint for the 5CGXFC7D6F31I7N - CYCLONE V FPGA. To proceed, we require the mechanical dimensions of the component. Can anyone please provide the following details:
- TOTAL THICKNESS
- STAND OFF
- SUBSTRATE THICKNESS
- MOLD THICKNESS
- BODY SIZE
- BALL DIAMETER
- BALL OPENING
- BALL WIDTH
- BALL PITCH
- EDGE BALL CENTER TO CENTER
- BODY CENTER TO CONTACT BALL
- PACKAGE EDGE TOLERANCE
- MOLD FLATNESS
- COPLANARITY
- BALL OFFSET (PACKAGE)
- BALL OFFSET (BALL)
Thank you for your time and assistance.
Hello,
You may find the information here : https://www.intel.com/content/www/us/en/support/programmable/support-resources/devices/fpga-package-thermal.html
regards,
Farabi
