Forum Discussion
SL10
New Contributor
5 years agoReflow profile, time above liquidous temperature
We found that field return units have cracked solder ball all at the ball/IC substrate interface for EPM570F256I5. Reflow profile review shows that the TL (time above liquidous temperature) was...
NurAiman_M_Intel
Super Contributor
5 years agoHi,
If you have further questions, please email our Quality team(Sam) that has reach out to you until next week. Else, we will need to set this case close.
Thank you.
Regards,
Aiman