Forum Discussion
SL10
New Contributor
5 years agoReflow profile, time above liquidous temperature
We found that field return units have cracked solder ball all at the ball/IC substrate interface for EPM570F256I5. Reflow profile review shows that the TL (time above liquidous temperature) was...
NurAiman_M_Intel
Super Contributor
5 years agoHi,
Thank you for the images. Our Quality team shall be in touch with you for further clarification.
Regards,
Aiman