Forum Discussion
KJalte2
Occasional Contributor
Occasional Contributorpdn1926-opn-list.xlsx の下記(a)(b)の影響で基板変更は必要ですか。 (a) Change from Dual-Piece Lid to Flat Top Single-Piece Lid (b) Change from Lidless to Molded (Thermal Composite) Package
The list of affected Ordering Part Numbers (OPNs) can be downloaded here: https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pdn1926-opn-list.xlsx
JonWay_altera
Frequent Contributor
Frequent ContributorHi @KJalte2
The package outline is different with the new package. You can compare the dimension for both the "N" and "G" at https://www.intel.com/content/www/us/en/programmable/support/literature/lit-index/lit-pkg/package.html?family=Arria_II
