Forum Discussion
Altera_Forum
Honored Contributor
8 years agoI took your advice and tried a MAX 10 build.
Using a Cyclone IV part I was able to fit the design in a EP4CE15F17C6 part, which is in a 256 pin package, 165 I/O pins. I actually had one entire bank of I/O left over. Using the MAX 10 family the restriction ended up being the number of I/O pins that would support the DDR2 memory. The smallest / cheapest device that would support a x16 DRAM appears to be the 10M16DCU324I7G I haven't been able to find an actual package drawing for this part yet but I believe it to be a 15mm x 15mm BGA with 0.8 pad spacing. So it is a higher pin count device in a smaller area. To use this device pushes the PCB layout into an entirely different arena. Now we are talking additional layers and micro-vias. That just blows the cost savings out the window. What I was really hoping for was some information on how to do a remote upgrade of the serial prom when using one of the configuration proms made by another company.