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JPisa2's avatar
JPisa2
Icon for New Contributor rankNew Contributor
6 years ago

I am leveraging the Max 10 FPGA (Part Number: 10M16DAF484I7G) and I'm looking for additional thermal information (Compact Thermal Model, or specific active area of die vs overall footprint).

I have not been able to find the information anywhere and this would help provide additional details in a thermal simulation. Thank you.

2 Replies

  • YuanLi_S_Intel's avatar
    YuanLi_S_Intel
    Icon for Regular Contributor rankRegular Contributor

    Hi,

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