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REics's avatar
REics
Icon for New Contributor rankNew Contributor
3 years ago

Equivalent pins in different packages? (10CL016YU256 vs. 10CL016YU484)

Hi there,

Due to part availability I need to change my existing 256pin design to use the 484pin version of the same Cyclone 10CL016 device. I don't need any extra I/Os, and ideally would like to use the same *.rbf file for both package variants.

Does this work if I use only I/O cells which are connected in both the 256pin and the 484pin variants? Where can I find which pins are equivalent (i.e. map to the same I/O cell)?

For example, I could see in the Pin Planner that the DIFFCLK_6n/p pairs are on pins T8/R8 in the 256UBGA and on AB11/AA11 in 484UBGA by matching their names, but how do I know this for "ordinary" pins? Is there any info where the package pins are internally connected to the die? I am quite sure that the die is the same for both devices but the 256UBGA has not all connections bonded.

Thanks!

Rolf

5 Replies

  • FvM's avatar
    FvM
    Icon for Super Contributor rankSuper Contributor
    3 years ago
    Hello,
    as far as see, pins have unique names in pinout files, should allow to match equivalent pins in different packages.
    • REics's avatar
      REics
      Icon for New Contributor rankNew Contributor
      3 years ago

      Unfortunately not all pins in the pinout files have unique names - many are just named "IO" together with the package-specific pin (i.e. "T8"). I need the information where the pins are internally connected to, e.g. the name of the respective I/O cell or something like that. In the pin planner I can see additional columns:

      - Pad number

      - X coordinate (0..41)

      - Y coordinate (0..29)

      These values seem to designate the location on the die. Can anyone confirm?

  • AqidAyman_Altera's avatar
    AqidAyman_Altera
    Icon for Regular Contributor rankRegular Contributor
    3 years ago

    Hi Rolf,


    Unfortunately, migration capability only possible if there are in the same packages where you can use the same *.rbf file, this is from what I understand. If both devices are in the same migration paths, it is possible to do I/O migration.


    However, from you case, both devices are in different packages. So, I would suggest you update the design accordingly.


    Regards,

    Aqid


  • AqidAyman_Altera's avatar
    AqidAyman_Altera
    Icon for Regular Contributor rankRegular Contributor
    3 years ago

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