Forum Discussion
Altera_Forum
Honored Contributor
14 years agoYou mean within the same package? I believe in the smaller packages, there are probably more than enough I/O on the die, but only so many on the package. As the die gets larger, more VCC/GND connections are needed, which are added at the expense of user I/O. In the largest package(780) you see the I/O count get smaller and then larger again. I'm guessing this package isn't limited by the number of I/O on the package for the smaller devices but the number of I/O on the die, but that's just a guess.