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Altera_Forum
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16 years ago

Cyclone III package question about EQFP144

I noticed that the EQFP144 package has an exposed pad on the bottom. I did not account for this in my board layout. How big of a problem is this?
Altera_Forum's avatar
Altera_Forum
Icon for Honored Contributor rankHonored Contributor
16 years ago

You should mostly care for a low inductance connection, sufficient current capability will be achieved then as a side effect. To make it act as a device heatsink, you may want to connect it by multiple vias to a ground plane.