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Tataria's avatar
Tataria
Icon for New Contributor rankNew Contributor
4 years ago
Solved

Altera parts package FC-FBGA are vented or not vented

Hello, We are using following parts. DPN Description Source MPN Source MFR Supplier Package MCKT,DGTL,ASIC;FPGA,UNALTERED 5AGXMA3D4F27I3G ALTERA CORP FC-FBGA MCKT,DG...
  • AqidAyman_Altera's avatar
    AqidAyman_Altera
    4 years ago

    Hi Mukesh Tataria,


    Thank you for your reply. After I did some discussion back with Ali, the person you contacted earlier, it is confirm that 5AGXMA3D4F27I3G is not a lidless package hence it is a vented package.


    I deeply apologize for the inconvenience you experienced due to the wrong information you received from me. Thanks for checking back to us.


AqidAyman_Altera's avatar
AqidAyman_Altera
Icon for Regular Contributor rankRegular Contributor
4 years ago

We do not receive any response from you to the previous question/reply/answer that I have provided. This thread will be transitioned to community support. If you have a new question, feel free to open a new thread to get support from Intel experts. Otherwise, the community users will continue to help you on this thread. Thank you.

  • Tataria's avatar
    Tataria
    Icon for New Contributor rankNew Contributor
    4 years ago

    Hello AqidAyman,

    I am really sorry for not responding your answer.

    But I am getting conflicting information about 5AGXMA3D4F27I3G is Arria-V device and it is a G part.

    Some one from Intel (Kozak, Ali <[email protected]>) sent the e-mail that this part is Vented. And your response was Not-Vented.

    So I was digging in to this information.

    One document I found it says " All lidless flip chip and wire bond packages are non-vented package. All other flip chip packages are vented package."

    So my confusion is which category this parts fall into?

    Please advise.

    Thank you so much for keep supporting us.

    Mukesh Tataria