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Tataria's avatar
Tataria
Icon for New Contributor rankNew Contributor
4 years ago
Solved

Altera parts package FC-FBGA are vented or not vented

Hello, We are using following parts. DPN Description Source MPN Source MFR Supplier Package MCKT,DGTL,ASIC;FPGA,UNALTERED 5AGXMA3D4F27I3G ALTERA CORP FC-FBGA MCKT,DG...
  • AqidAyman_Altera's avatar
    AqidAyman_Altera
    4 years ago

    Hi Mukesh Tataria,


    Thank you for your reply. After I did some discussion back with Ali, the person you contacted earlier, it is confirm that 5AGXMA3D4F27I3G is not a lidless package hence it is a vented package.


    I deeply apologize for the inconvenience you experienced due to the wrong information you received from me. Thanks for checking back to us.


AqidAyman_Altera's avatar
AqidAyman_Altera
Icon for Regular Contributor rankRegular Contributor
4 years ago

Hi Tataria,


5AGXMA3D4F27I3G is Arria-V device and it is a G part, thus it does not have lid. The die is exposed without any lid so can said that the question on air-vent is not applicable here.


On the other hand, 10AX022E3F29I2LG and 10AX115H1F34I1SG are both from the Arria 10 Device family so they are come with the heat spreaders (lids) and the air vent is available in this case.


You can refer to the Package Device Information for the Arria V devices through this link, https://www.intel.com/content/www/us/en/support/programmable/support-resources/devices/package.html?family=Arria_V


For the Arria 10 devices, you can refer through this link, https://www.intel.com/content/www/us/en/support/programmable/support-resources/devices/package.html?family=Arria_10


Hope this helps.