we want to apply FA

1. Please provide full device details.

Device name: IC,PLD-FPGA,EP4CGX75D-7,FBGA672, 1.2V, 1.0mm, PB-Free,C-TEMP (0 to 70'C)

Full part number: CISH-16-4405-01/ EP4CGX75DF27C7N

2. What is the failure rate? What is the failure rate vs. tested sample? Example: 2 out of 100 units.

1/350=0.29%

3. What is the failure symptom? Please elaborate the failure symptom in detail.

Get ROMMON failed at 2C station

4. When did the failure happen? How did you discover the failure?

2019/02/14 ,The board failed at 2C station, failure code is Get ROMMON failure, the Post code LEDs

(CR0/CR3/CR4/CR6_P80) keep solid light.

5. How did you determine the failure? Please elaborate the procedures.

This board failed to get Rommon at 1st time under 0’C, and retest the board failed at room temp 25’C. and we can duplicate it under room temperature.

6. Does the failure unit ever working before failure?

Yes, but rejected by your site for FA, Now cisco required us to send to you for FA.

7. Did they violate solder re-flow temperature profiles, moisture sensitivity? Please provide the re-flow temperature profiles.

Not violate

8. Did you swap the failure device to a known good board? Is the failure following the device or board?

We are doing swap for the device on a known good board.

9. Is this a prototype build or volume/mass production?

Mass production

10. Kindly provide quantitative investigation result that could proof the failure is Intel FPGA induced.

See in attachment for FA.