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ALahn's avatar
ALahn
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7 years ago

Reballing recommendation

Dear Sirs . Our client have a question about the reballing of the Altera microcircuit in the package of 672-FBGA (client wants to change Pb-free balls to SnPb). Do you accept reballing process? Do...
ChiaLing_T_Intel's avatar
ChiaLing_T_Intel
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7 years ago

Hi,

You can refer to AN353 document which describes the board assembly process used in surface-mount technology (SMT) and focuses on the SMT component-to-board reflow soldering.

https://www.intel.com/content/dam/altera-www/global/en_US/pdfs/literature/an/an353.pdf

However, please be noted that Intel FPGA does not recommend to have a mixed alloy reflow process as it is not easy to control. For details, please refer to the link below:

https://www.altera.com/support/support-resources/knowledge-base/solutions/rd06062012_116.html

Thank you

Regards,

Chia Ling