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UVonS's avatar
UVonS
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6 years ago

HTOL Tests performed for Cyclone IV FPGA - socket mount or soldered on PCB?

Dear all,

In our fault tree analysis we rely on reliability values for the CycloneIV FGPAs found in the “Intel Reliability Report (1H 2017) – MNL-1085”. To have the a proper argumentation chain, we assume that the devices have been solder on a PCB (not put in a socket mount) for the HTOL-Tests. Can you please confirm this?

Best regards,

David

3 Replies

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    6 years ago

    Hi David,

    Thank you for contacting Intel community.

    Please be noted that i am currently checking this request with my internal team. Meanwhile, may i know the purpose of this information to you?

    Thank you.

    Regards,

    Aiman

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    6 years ago

    Hi,

    BI and HTOL tests are done on units that go into sockets on respective boards.

    Thank you.

    Regards,

    Aiman

  • NurAiman_M_Intel's avatar
    NurAiman_M_Intel
    Icon for Super Contributor rankSuper Contributor
    6 years ago

    Hi,

    If there is no further information needed, i will continue to close this case. Feel free to reopen or open a new case if there is further information needed.

    Thank you.

    Regards,

    Aiman