Forum Discussion

JDocl's avatar
JDocl
Icon for New Contributor rankNew Contributor
6 years ago

Hi Intel, I am researching for the device LE82GME965 SLA9F and i cannot find the baking condition of the part. Could you advise the baking condition (temp and time).

Also, i believe the baking condition is based on package thickness, am i correct? Hope to hear from you soon. Thank you!
Deshi_Intel's avatar
Deshi_Intel
Icon for Regular Contributor rankRegular Contributor
6 years ago

Hi,

Unfortunately Intel is a very big organisation with different group supporting different product.

Intel FPGA forum support agent is not familiar with Intel chipset product.

Perhaps you can try out -> Hardware Products -> processors forum. The processor forum support agent maybe able to provide better guideline to you.

Thanks.

Regards,

Intel FPGA support agent