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spong1303's avatar
spong1303
Icon for New Contributor rankNew Contributor
3 years ago
Solved

BGA ball composition and melting point for MPN: 5M160ZM100C5N

As below information is unable found in the datasheet, pls help to check & provide BGA ball composition and melting point for MPN: 5M160ZM100C5N.
  • AqidAyman_Altera's avatar
    AqidAyman_Altera
    3 years ago

    Hi Supeng,


    Thank you for reaching out to Intel FPGA Community.


    For your request, I need to check with the respective team. I will provide the information once I received it as soon as possible.


    Regards,

    Aqid Ayman


AqidAyman_Altera's avatar
AqidAyman_Altera
Icon for Regular Contributor rankRegular Contributor
3 years ago

Hi Supeng,


The BGA ball composition for MAX V CPLD is Sn:Ag:Cu = 96.5:3.0:0.5.

The melting point of SAC305 solder ball is 217'C.


Regards,

Aqid Ayman