2reSolve
New ContributorJoined 2 years ago
User Profile
New Contributor
User Widgets
Contributions
Re: 10M08SCE144C8G Temperature Issues
I've already tried setting "Toggle Rate" to "0 MHz" on both adjacent output pins 28 and 30 adjacant of PLL clock input pin (CLK_50M) in pin location 29 with different "Current Strengt" and "Slew Rate" settings without any success so far. Also, Quartus does not seem to allow the User to Suppress Error Message (18496). It seems like Intel simply do not allow override of their Signal Integrity Design Guidelines for the Clock Input Signal: This is just fine, that is until you realize each and every single pin of the 144pins in your hardware design has already been spoken for. So maybe my best and only option right now is to have my FPGA designer work on this problem using an older version of Quartus with its "preliminary timing models" even though this is far from optimal. If Intel allowed to Suppress Error Message (18496) we could instead work on this problem using the latest Quartus version.Re: 10M08SCE144C8G Temperature Issues
Buying the FPGA chips from authorized distributor this time did not solve this issue. Also, after hiring an FPGA expert for reviewing our FPGA design we are informed the project does not build because of Error (18496): The Output TLK_TX[1] in pin location 28 (pad_1628) is too close to PLL clock input pin (CLK_50M) in pin location 29 (pad_1) This errror was not present (even as a warning) when the project was originally build with Quartus II 15.0.2.153 back in 2015. So please, is there "a work around" for Error (18496) which allows this project to build with the newer Quartus versions?Re: Error (18496): The Output SCLK in pin 26 is too close to PLL clock input in pin 27
I also need urgent help to override this fitter Error (18496): The Output TLK_TX[1] in pin location 28 (pad_1628) is too close to PLL clock input pin (CLK_50M) in pin location 29 (pad_1) Our FPGA and hardware design was also back in 2015 using Quartus v15.0.2.153 1. Have anyone found a work-around on this problem? 2. Can Intel help come up with a solution to this problem?Re: 10M08SCE144C8G Temperature Issues
Hello Naim, Thanks for your attantion on this issue. Any info you may share which would help resolve this issue will be greatly appreciated. Meanwhile, as per FvM suggestions, we will have an FPGA expert characterize and observe the function failure in detail, review the original design for possible timing constraint vacancies and other trap doors. Hopefully this will bring a solution to our problems. Best, ToreRe: 10M08SCE144C8G Temperature Issues
1. OK 2. We will hire an external FPGA consultant which will recompile the project and perform the necessary simulation and design verification and testing at different temperatures. 3. No, unfortunetly we currently do not. So, as per now, we only know that 33% of these boards fails their function test at 20-25C room temperature. If we were to lower the temperature below room temperature, we would expect an even higher persentage. We Will look into the capacitor issue. Sorry about the unclear langue. And yes, I really mean "The FPGA doesn't fulfil its function at room temperature (and below)".Re: 10M08SCE144C8G Temperature Issues
Thanks for this input Matt. 1. We will investigate this Errata carfully. 2. Yes, same binary was used. The .pof compile date is 2016-06-07. We will look into re-compiling the project. 3. Sorry. The FPGA does not work at all at 20-25C room temperature. But this only appy to about 1/3 of the 2301 dated FPGA units. We don't think the FPGA parts are fake, but we can't know 100% for sure they are not re-purposed/used parts. The firmware for these FPGA's was originally designed by an external consultant (as we lack in-house FPGA expertice). Sadly, this consultant is no longer available so we are now in contact with some other consultants to solve this.10M08SCE144C8G Temperature Issues
Hi, We're having some wird temperature issues with some newer 10M08SCE144C8G FPGA chips date marked with "2301A". The FPGA chips are used in an older MUX design "which have always worked before". Some of the "2301A" chips, however, does not operate as normal at 25C room temperature. However, if we apply external heating they suddenly start working as normal at arond 35-50C. Looking at some of our older circuits boards without temperature problems, with FPGA chips date marked "2007A", I cannot help notice the text painted in white color is very easy to read: Old, working FPGA. Please notice clear, white text. Compared to examining the newer "2301A" boards, the one with temperature problems, the text is almost impossible to read, like the white paint inside the text is completely missing: Newer, failed FPGA. Is the more unclear text a sign of soldering heat damage? What's the most possible explonation: 1. The FPGA has been mounted using the wrong soldering profile with to high temperature 2. Intel has simply removed the white paint from its Altera MAX 10 chips. Nothing to worry about. 3. These are fake, chineese duplicates (and yes, these boards have been assembled in China). Please advice.
