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VenuBusani's avatar
VenuBusani
Icon for New Contributor rankNew Contributor
3 years ago

Heatsink requirement

Hello team, In our design we are using the altera/intel part EP1K50FI256-2. Since this is BGA package and assemble in closed module can you please suggest the recommended heatsink for this part
ak6dn's avatar
ak6dn
Icon for Regular Contributor rankRegular Contributor
3 years ago

That is not something someone else can tell you easily.

You understand (I hope) the environmental thermal characteristics you are targeting for operation, the design of your enclosure, and the estimated power dissipation of your device(s). Then your thermal engineer (you do have a thermal engineer on the project, correct?) can run all the numbers and provide recommended solutions to keep your device within operational limits.

If you truly have a closed box (ie, no external air convection) you have a an interesting/difficult problem on your hands.