Forum Discussion
Hi Siew Ying,
I apologies for the miss understanding. By referring to the Intel FPGA Failure Analysis Service - we test all devices for shorts and opens before the devices leave our factory. All our devices are fully tested as good before shipped to customer. The purpose of production testing during manufacturing is to screen out bad units:
We could guarantee devices leave factory door in good condition. Once shipment leaves factory, we are no longer liable as it subjects to forwarder’s handling, distributor’s handling and customer’s handling. There is no way to tell if the damages are done before devices leave factory door. Therefore, no failure analysis or part replacement will be proceed due to the missing ball issue reported.
Thank you
Regards,
Chia Ling