Forum Discussion
SSoh1
New Contributor
7 years agoHi Chia Ling,
Even the part has passed all the test and screening, it does not rule out the fact of failure. the solder ball maybe not firmly adhered to the component, it gets weaker and finally drop off after going through all the test and screening.
Secondly, it’s Intel responsibility to ensure product is properly packed to prevent it from damage during the transportation.
How could Intel simply stay away from the problem?
Best Regards,
Siew Ying
OSI Electronics Pte Ltd.
240 MacPherson Road
Pines Industrial Building #07-05
Singapore 348574
Tel: 65-6468-9877 #6167
Fax: 65-63538486/3634
Email: ssoh@osielectronics.com<mailto:ssoh@osielectronics.com>
www.osielectronics.com<http://www.osielectronics.com>