New Contributor
ContributorHi Siew Ying,
We apologies for any inconvenient cause on you. From your description showed there is a missing ball issue observed on 5SGXMA4H3F35C4N.
For your information, Intel FPGA perform 100% Ball Scan prior to shipment, so it's unlikely that the device will have been shipped with a missing ball. There is a high possibility that it was damaged in transit or shipping or improper storage. We have ball scan and visual test. Plus, we have drop test proved packing. we test all devices for shorts and opens before the devices leave our factory. All our devices are fully tested as good before shipped to customer. The purpose of production testing during manufacturing is to screen out bad units and in the case of this case, short in circuit diagram. The purpose of production testing during manufacturing is to screen out bad units and in the case of this request, the missing solder ball would not pass the open/short test.
Intel FPGA Reliability Report had stated clearly that we perform comprehensive testing and manufacturing controls on all its products:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/rr/rr.pdf
We could guarantee devices leave factory door in good condition. Once shipment leaves factory, we are no longer liable as it subjects to forwarder’s handling, distributor’s handling and customer’s handling. There is no way to tell if the damages are done before devices leave factory door. Therefore, no RMA will be proceed due to the missing ball issue reported.
You can look into this to come out some corrective action. Meanwhile, you may referring to the solution below on the maximum downward pressure that can be applied to the top of BGA
Thank you
Regards,
Chia Ling
