Forum Discussion
3 Replies
- ChiaLing_T_Intel
Contributor
Hi Pbins,
Thank you for contacting Intel Community. Would you share with me how the difference chip look like between this 2 parts?
For your information, Intel FPGA is introducing "Green" Bill of Materials for the Cyclone II device families in year 2012. There is a slight increase to the mold compound coverage for F672 packages devices. For details, kindly refer to PCN1105:
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pcn1105.pdf
Thank you
Regards,
Chia Ling
- PBINS
New Contributor
- ChiaLing_T_Intel
Contributor
Hi Pbins,
By referring to PCN1105, Figure 1, you will notice there would be two different mold area observed.
https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/pcn/pcn1105.pdf
Intel FPGA is introducing "Green" Bill of Materials for the Cyclone II device families in year 2012, so it is expected to have 2 different outlook.
Next, Intel PSG has its authorized distributor to sale Intel devices. If the customer got the devices from formal distributors, they shouldn’t worry on the device authenticity as the devices must be valid units. Otherwise, we do not ensure the device quality and do not provide the further service. You may find the authorized distributor list from the link below:
https://www.intel.com/content/www/us/en/programmable/buy.html
Thank you
Regards,
Chia Ling