Forum Discussion
MatthiasWestermann
New Contributor
New ContributorMAX10 BGA256 stencil parameter
Hello, i use MAX 10 10M16DCF256 and 10M16DAF256 in a project. Unfortuneatly, i did not find the stencil parameters for the BGA256 package in the datasheet or on the Intel homepage. Could you please ...
Farabi_Altera
Regular Contributor
Regular ContributorHello,
You can refer to this link : https://www.intel.com/content/www/us/en/support/programmable/support-resources/devices/package.html?family=MAX_10
regards,
Farabi
MatthiasWestermannNew Contributor
New ContributorHi Farabi,
in these documents i could only find the mechanical dimensions of the packages but no solder paste / solder stencil parameters.
I found some parameters for the BGA256 package with 1 mm ball pitch and 0,45 mm pad size from Texas Instruments:
- stencil thickness: 150 µm
- stencil aperature: 0,45 mm
Do you think these stencil parameters will also fit for the MAX10 in the BGA256 package?
