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MatthiasWestermann's avatar
MatthiasWestermann
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2 years ago

MAX10 BGA256 stencil parameter

Hello, i use MAX 10 10M16DCF256 and 10M16DAF256 in a project. Unfortuneatly, i did not find the stencil parameters for the BGA256 package in the datasheet or on the Intel homepage. Could you please ...
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MatthiasWestermann's avatar
MatthiasWestermann
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2 years ago

Hi Farabi,

in these documents i could only find the mechanical dimensions of the packages but no solder paste / solder stencil parameters.

I found some parameters for the BGA256 package with 1 mm ball pitch and 0,45 mm pad size from Texas Instruments:
- stencil thickness: 150 µm

- stencil aperature: 0,45 mm

Do you think these stencil parameters will also fit for the MAX10 in the BGA256 package?