Forum Discussion
Mostafa_Intel_AE
Occasional Contributor
6 years agoHello Matthew,
Below is the summary of the substrate pad finish of EM21XX built by different suppliers:
The Au plating thickness on the substrate pad is: Au 0.05-0.1um or Au 0.1um (min.) depending on assembly suppliers.
- EM2120H01QI / EM2120L01QI / EM2130H01QI / EM2140P01QI :
- Hana assembly - Ni: 5um (min) / Au: 0.05 - 0.1um
- Unisem assembly - Ni: 2-5um /Pd: 0.1-0.2um/Au: 0.1um (min)
- ASEKH assembly - Ni: 5um (min) / Au: 0.05 - 0.1um
I hope this solve your question.
Thanks,
Mostafa