FPGA Device lifetime

Those boards use Xilinx FPGAs, mainly Spartan 2 devices.

Regarding configuration they are similar to Cyclone III: SRAM based and configuration loaded upon power up or reset from an external non-volatile memory device. So, I think the comparision I made could be consistent.

I now use Cyclone III but I haven't long term data, yet.

I expect newer device should be even more reliable than those released many years ago and then with improved lifetime.

Reconfiguration frequency in my case changes on a wide span, depending from customer application. It ranges from customers who never stop the machine for days, to others who turn off and on the machine several times a day.

The problem with solder joints is usually found on the board just after production, especially with BGA devices. On the field the problem happened sometimes after few years, probably due to pre-existent soldering defect or mechanical PCB stresses. Anyway I again say that failure of the device on field is a rare event, and it is usually due to improper use or handling, i.e. bad user connections or ESD.