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Altera_Forum
Honored Contributor
Honored Contributorexposed pad in EQFP package
Hi, I have a problem with the exposed pad in the EQFP 144pin package. What is the correct way the connect the exposed pad to the PCB ? I cannot simple solder it because it has height a...
Altera_ForumHonored Contributor
Honored ContributorI see, that the height difference is specified with min. 0.3 mm in the package data sheet. I must confess, that I didn't yet use this particular EP3C package, but similar enhanced pad TQFP from other vendors. The assembly service providers didn't yet complain about it and in prototype assembly, you have no problem to apply sufficient solder paste.
In my opinion, solder paste and hot plate are optimal for single sided prototype SMD assembly (up to a certain board size). P.S.: Sorry, I looked at the wrong table. The height is specified 0.05 mm min, 0.15 mm max, sounds more reasonable. There should be no problem to get the solder paste in contact with the IC pad, even if the finished solder joint will not cover the pad uniformly.
